solverpi-'och tIq 1600 x

solverpi-'och tIq 1600 x
product details

pong product:thermoplastic Polyimide Moulding 'och tIq

ghobe' item:solverpi-'och tIq 1600 x

size vIQoy: ≥800 vIQoy

SPECIFICATIONS:

bang

waH method

unit

lo'laHghach

basic yIqaw

Hoch

/

/

wov SuD

linear expansion coefficient

(23-30℃)

GB GHAP RUT 1036-1989

1/℃

3.68*10-5

ghu'vetlh(25℃)

/

g ghap cm3

1.38

intrinsic viscosity

Q GHAP HSMT

dL ghap g

0.5-0.8

rockwell hardness

(m)

GB GHAP RUT 3398.2-2008

/

110

yInSIp index

GB GHAP RUT 2406.2-2009

%

46

combustion chong

GB GHAP RUT 2408-2008

patlh

V-0

mechanical bang

tensile HoS

GB GHAP RUT 1040.2 GHAP 1A-2006

mpa

108

elongation DeSDu' ghor

GB GHAP RUT 1040.2-2006

%

15

mup HoS

(pagh gap)

gb ghap 1043.1 ghap 1eu-2008

kj ghap m2

244

wanHa' HoS

GB GHAP RUT 9341-2008

mpa

135

compression HoS

GB GHAP RUT 1041-2008

mpa

136

coefficient friction

GB GHAP RUT 3960-1983(1989)

/

0.43

thermal yIqaw

thermal deformation Hat(1.80mpa)

GB GHAP RUT 1634.2-2004

250

HIvje' transition Hat (voQSIp muD)

GB GHAP RUT 19466.2-2009

260

electrical bang

dielectric HoS

GB GHAP RUT 1408.1-2006

mv ghap m

16.3

muq resistivity

GB GHAP T1410-2006

Ω·m

2.0*1014

definition:jen molecular ngI', vIvup mobility, molding lo'. thermoplastic pi amorphous resin, products chenmoH vo' thermoplastic pi amber 'ej transparent.

'elbogh Characteristics:

lresistance, woj resistance, yu'egh QaQ penetrate laH creep;

lresistance QaQ corrosion, moisture absorption veb puS ordinary plasticslightly;

lwej resistant HoS pey, SeS alkali 'ej jen Hat(neH Shortcomings);

qaStaHvIS mu', SOLVERmitsui aurum laH wabmeyvetlh ngaSwI' yuvtlhe' wIngaQmoHta'DI' thermoplastic Polyimide Moulding 'och tIq (solverpi-powder1600).

'utmo' Dujvam HeghDI' compared je latlh le' jonpIn mep:

1. compared peek\pps, thermoplastic pi crystalline QI'yaH, cha' Dunmo' stability mechanical bang size DeSDu' jen Hat je je. wa'vatlh taH mep crystalline crystallization pagh crystallization QIH lo'lu'DI' Hat DuqIppu'chugh tg tm, mechanical choH luH 'ej dimensional stability, nup resistance reducing creep.

2. compared ptfe, net poQbej dimensional stability, resistance creep Dunmo' 'ej jen HoS, shortage resistance corrosion Qugh, 'ach.

3. qaStaHvIS jen pagh 'eS Hat yIqaw stabler yIqaw. processing Hat laH 340-380, ghuS puS aurum. 'oH ghobe' nIS mIw tuj treatment qaSpu'DI' molding.

4. thermal bang: tg:260, HDT:250, Hat lo' nI'taHvIS 240. DeSDu' poH rap je ghaj majQa' yIqaw 'eS Hat resistant, vaj not brittle fracture DeSDu'-269 Hatpa' tIn mInDu'Daj 'ej boch voQSIp.

compared bmi

bmi yIqaw vI'Iprup brittle, wItlh 'oH during mIw lo'.

cha' solverpi-'och tIq 1600 x je tet Sep duringthermoplastic molding, adhesion 'ej toughness 'oHbe' net poQbej vaj Dov'agh pe'vIl vaj pumDI' qoghlIj.

usage yIn nI'qu'. laH, qatlh bmi lo' 4 rep, Datoy'taHvISsolverpi-'och tIq 1600 xlaH lo' continuously tuqnIgh 72.

Hat lo' laH veb.solverpi-'och tIq 1600 xlaH pol ngaDmoH 'emvo' 240

pa' high-end abrasive german neH polyimide lo' law' binder.

application:

Hoch bIquv mIqta', 'ay' va, such as ta'wIj'e' Ha', Ha' ngaQ 'ej Dunbogh jom press, press jan'e', rod, Separ tools etc grinding bush.

poQ jen grade Separ abrasive thermoplastic pi tIn SeH requiremen laH wej ghom adhesives potlhmeyDaq

rIn Samples:


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