solverpi-'och tIq 1600

solverpi-'och tIq 1600
product details

pong product:thermoplastic Polyimide Moulding 'och tIq

ghobe' item:solverpi-'och tIq 1600

size vIQoy:≥200 vIQoy

SPECIFICATIONS:

bang

waH method

unit

lo'laHghach

basic yIqaw

Hoch

/

/

wov SuD

linear expansion coefficient

(23-30℃)

GB GHAP RUT 1036-1989

1/℃

3.68*10-5

ghu'vetlh(25℃)

/

g ghap cm3

1.38

intrinsic viscosity

Q GHAP HSMT

dL ghap g

0.5-0.8

rockwell hardness

(m)

GB GHAP RUT 3398.2-2008

/

110

yInSIp index

GB GHAP RUT 2406.2-2009

%

46

combustion chong

GB GHAP RUT 2408-2008

patlh

V-0

mechanical bang

tensile HoS

GB GHAP RUT 1040.2 GHAP 1A-2006

mpa

108

elongation DeSDu' ghor

GB GHAP RUT 1040.2-2006

%

15

mup HoS

(pagh gap)

gb ghap 1043.1 ghap 1eu-2008

kj ghap m2

244

wanHa' HoS

GB GHAP RUT 9341-2008

mpa

135

compression HoS

GB GHAP RUT 1041-2008

mpa

136

coefficient friction

GB GHAP RUT 3960-1983(1989)

/

0.43

thermal yIqaw

thermal deformation Hat(1.80mpa)

GB GHAP RUT 1634.2-2004

250

HIvje' transition Hat (voQSIp muD)

GB GHAP RUT 19466.2-2009

260

electrical bang

dielectric HoS

GB GHAP RUT 1408.1-2006

mv ghap m

16.3

muq resistivity

GB GHAP T1410-2006

Ω·m

2.0*1014

definition:jen molecular ngI', vIvup mobility, molding lo'. thermoplastic pi amorphous resin, products chenmoH vo' thermoplastic pi amber 'ej transparent.

'elbogh Characteristics:

lresistance, woj resistance, yu'egh QaQ penetrate laH creep;

lresistance QaQ corrosion, moisture absorption veb puS ordinary plasticslightly;

lwej resistant HoS pey, SeS alkali 'ej jen Hat(neH Shortcomings);

qaStaHvIS mu', SOLVERthermoplastic Polyimide Moulding 'och tIq

mitsui aurum laH wabmeyvetlh ngaSwI' yuvtlhe' wIngaQmoHta'DI' (solverpi 'och tIq 1600).

application:

Hoch bIquv mIqta', 'ay' va, such as ta'wIj'e' Ha', Ha' ngaQ 'ej Dunbogh jom press, press jan'e', rod, Separ tools etc grinding bush.

poQ jen grade Separ abrasive thermoplastic pi tIn SeH requirements laH wej ghom adhesives potlhmeyDaq.

mould Samples:

inquiry