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Polyimide summary

polyimide neHqu' comprehensive bang organic polymer Hap 'u', jen Hat 400 ℃, nI'taHvIS lo' Hat range-200 300 DEG [taH, pagh lang melting obvious, jen insulation resistance, dielectric ru'Ha'wI' 4 103 hz wa', vaj dielectric loss neH 0.004 ~ 0.007, f h grade insulation Hap 'u'.

refers pi yIteb backbone acyl imino polymer, baS aromatic compounds SeH, qon cha' yuan cha' yuan amine anhydride qeq condensation polymerization je ngaS. yIteb mI' Ha' benzene, Sev molecular mIr pi incorporated imide ghom vaj benzene Qeb vagh membered heterocyclic Qeb formation 'ej, molecular mIr, intermolecular rigidity raD HoS, ghu'vetlh packing jen, series bang pov ghaj pi. pi muHIvtaHbogh tlham cha' anhydride consisting 'ej cha' amine tlhoS rap, yIqaw je Du'meyDaq difference.

veSHey le' jonpIn Hap 'u', widely lo' neH aviation, aerospace, microelectronics, nanotechnology, tIn mInDu'Daj 'ej boch qut, separation membrane, 'uD yotlh polyimide. qen, rav 'e' lay' wa' Engineering mep DaH nobvam qaStaHvIS cha'maH-wa'DIch vatlh DIS Hoch Sep Qul, development 'ej utilization polyimide. polyimide. ghaH because of outstanding characteristics bang synthesis, QInvam batlhchaj je structural Hap 'u' pagh je functional Hap 'u', 'ej, fully yaj prospect nuj tInqu' ghaj application, Sov "qay' solver", 'ej 'e' "DaHjaj Microelectronic cham wej ghaj pagh polyimide".

aromatic heterocyclic polymer molecular tlham polyimide compounds laH wav imide ghom mIr, tera' Polyimide ((pi)), Sev vaj benzene pi, soluble pi, polyamide imide (pai) polyether imide (pei) loS je.

pi nIvbogh Sar tuj-resistant jonpIn mep DeSDu' jen Hat wa', 'op Sar chaq tIq jen Hat 290 ℃ yopwaH bID poH 490 'ach ghaytan withstand yIqaw tuQ ℃, mechanical bang, fatigue resistance, DungDaj retardant bang electrical, dimensional stability, QaQ, mold shrinkage mach, oil resistance, pey 'ej organic solvents, wej alkali resistance, pov resistance friction,.

thermoplastic polyimide resin (Polyimide resin), referred pi je) thermoplastic mep jonpIn. jen Hat resistant thermoplastic mep, ghaH jen HIvje' transition laH lo' Hat (243 DEG [taH) melting lang (334 ℃), tuj deformation Hat porghDaj moH 260 ℃ (30 vatlhvI' HIvje' fiber carbon fiber pagh reinforce grade), 'ej tIq poH DeSDu' 250 ℃, 'ej latlh jen Hat resistant mep as compared with PEEK, pps ptfe, ppo, etc., upper vuS Hat veb puS ℃ tlhoS 50; lo'

wej neH tuj resistance resin pi puS pov, 'op 'utmo' Dujvam jen HoS, jen modulus, jen fracture toughness 'ej pov stability dimensional mep jen latlh Hat resistant; jen HoS DeSDu' jen Hat laH leH pi resin, wanHa' HoS DeSDu' 200 ℃ Da'elDI' vIHtaHbogh 24mpa. ghaH DeSDu' 250 ℃ wanHa' HoS bIHub'eghtaHvIS compression 12 ~ 13mpa; pi resin rigidity, QaQ size stability, 'eS coefficient expansion linear, close to baS aluminum Hap 'u'.

pov chemical resistance, qaStaHvIS peQ, neH qIm sulfuric pey ngoS pagh 'oH, corrosion resistance 'ej nickel yoDSutlIj naQ Qaw' chemicals nagh 'ej tlhIch 'ej SuQ SIp, anti woj laH release je DungDaj DungDaj retardant, QaQ toughness, alternate stress pov fatigue resistance je pi resin 'ach outstanding Hoch mep, alloy Hap 'u' ghaH comparable;

resistance 'eS friction coefficient 'ej tuQ tribological bang pi resin je outstanding resistance tuQ sliding 'ej tuQ, yIqaw pov, especially, petaQ leH jen fretting DeSDu' 250 ℃; resin ngeD extrusion pov HablI' yIqaw, jen molding efficiency molding, injection 'ej PI.

loQ addition, SoHDaq lubrication, ngeD processing, insulation stability, hydrolysis resistance latlh pov yIqaw, widely lo' medical aerospace, automotive, electrical je, va, Soj prospects processing latlh yotlh, development 'ej utilization 'ej jIHMej je je pi.